IF2005M
No clean, halide free, No residue™ soldering flux
IF 2005 series application document
Description:
Interflux® IF 2005M is a low solids no-clean flux, designed to evaporate during the soldering process. This means also the safest no-clean flux for high-tech circuits.
With no rosin or resin to create a sticky residue, there is nothing left after wave soldering to foul test pins or prevent electrical contact. Machine and carrier pollution is very little compared to other fluxes.
This halide free flux meets all Bellcore and IPC requirements and is QPL- listed (approved to MIL-F14256F). It is formulated to provide the best combination of solderability, ease of processing and reliability. Great solderability on HAL, Ni Au, I-Sn, I-Ag and OSP coated PCB’s.
IF2005M works great with lead-free alloys. It is resistant to elevated preheating temperatures, and to a long wave contact time with a higher working temperature.
The flux has very high compatibility with conformal coatings. The IF 2005M is classified OR/L0 per IPC J-STD-004. IF 2005M is also available in refillable flux pens for hand soldering.
Physical properties
| Appearance | Clear colourless liquid |
| Solid content | 1,85% ± 0,15 |
| Density at 20°C | 0,807—0,809 g/ml |
| Water content | 3-4% |
| Acid number | 14 – 16 mg KOH/g |
| Flash point T.O.C | 15°C (59°F) |
Key advantages:
IF 2005K
No-clean, halide free soldering flux
IF 2005 series application document
Description:
Interflux® IF 2005K is a low solids no-clean flux, especially designed for lead-free wave soldering.
IF 2005K can also be used for SnPb wave soldering or selective soldering, however in these cases, respectively IF 2005M and IF 2005C are the first choices.
The IF 2005K activation system has been designed to give optimal wetting on virtually all lead – free surface finishes ,including OSP.
The flux is absolutely halide free, making it a very safe, reliable flux, extremely suitable for high end electronics, as well as for all other branches of the electronics industry.
All flux components can evaporate during the soldering process.
With no rosin nor resin to create sticky residue, there is nothing left behind after wave soldering to foul test pins or prevent electrical contact. Machine and carrier pollution is very little compared to other fluxes.
The flux is classified as OR/L0 according to EN and IPC standards.
Physical properties
| Appearance | Clear colourless liquid |
| Solid content | 2,5% ± 0,3 |
| Density at 20°C | 0,810 g/ml — 0,812 g/ml |
| Water content | 3-4% |
| Acid number | 18 – 22 mg KOH/g |
| Flash point T.O.C | 15°C (59°F) |
Key advantages:
IF 2005C
No-clean, halide free soldering flux
IF 2005 series application document
Description:
Interflux® IF 2005C is a low solids no-clean flux, especially developed for selective soldering in lead-free and SnPb applications. It is the version of the IF 2005- series with the largest process window in activity.
IF 2005C is also suitable for wave soldering but IF 2005K and IF 2005M are the first choice for respectively lead-free and SnPb wave soldering.
IF 2005C has excellent solderability with lead-free alloys and on virtually all finishes (NiAu, I-Sn, HAL, Cu-OSP,…). It is resistant to elevated preheat temperatures, and to long contact times with a higher working temperature. This makes IF 2005C the best choice for selective soldering.
This absolutely halide free flux meets the EN, Bellcore and IPC requirements. It is formulated to provide the best combination of solderability, ease of processing and highest reliability.
All flux components can evaporate during the soldering process. This means also the most safe no-clean flux for high-end electronics.
With no rosin nor resin to create sticky residue, there is nothing left behind after soldering to foul test pins or prevent electrical contact.
The flux is classified as OR/L0 according to EN and IPC standards.
Physical properties
| Appearance | Clear colourless liquid |
| Solid content | 3,3% ± 0,3 |
| Density at 20°C | 0,813 g/ml — 0,815 g/ml |
| Water content | 3-4% |
| Acid number | 26 – 30 mg KOH/g |
| Flash point T.O.C | 15°C (59°F) |
Key advantages:
Selectif 2040
VOC-free, no-clean soldering flux for selective soldering
Technical Data Sheet SelectIF 2040
Description:
SelectIF 2040 is a VOC-free and no-clean soldering flux developed for selective soldering.
The flux combines a wide process window in selective soldering with low residue formation.
SelectIF 2040 is suitable for soldering units with high thermal mass and hence high temperatures and long process times.
Due to its special composition, it leaves less residues after soldering than the conventional fluxes for selective soldering. SelectIF 2040 tends to give low solder balling after soldering.
The flux is compatible with leadfree and SnPb alloys.
Additionally, the flux is absolutely halogen free, guaranteeing a high reliability after soldering.
Physical and chemical properties:
| Density at 20°C | 1,00 g/ml ± 0,01 |
| Colour | clear |
| Odour | sweet |
| Solid content (activity) | 6,5 % ± 0,2 |
| Halide content | 0,00 % |
| Flash point (T.C.C) | n.a. |
| Total Acid Number | 44 mg KOH/g ± 2 |
| IPC/ EN | OR/ L0 |
Key advantages:
Pacific 2009M
VOC free, no-clean and halide free soldering flux for spray applications
Technical Data Sheet Pacific 2009M
Cleaning Pacific 2009M by KIZEN
Preheating for water based fluxes
Description:
The Interflux® PacIFic 2009M is an environmental friendly flux especially developed without the use of any volatile organic compounds.
The flux does not contain any halides, neither rosins nor resins. The absence of rosin and resin will give very low ICT contact problem faults. PacIFic 2009M has very good wetting capacity and excellent soldering on all popular board finishes. It is suitable for soldering with normal SnPb and leadfree alloys and for components and PCB-finishes with critical solderability.
PacIFic 2009M allows a changeover from alcohol based fluxes to water based fluxes with absolutely no disadvantages.
Physical and chemical properties:
| Density at 20°C | 1.00 g/ml ± 0.01 |
| Colour | clear |
| Odour | sweet |
| Solid content (activity) | 3.7% ± 0.15 |
| Halide content | 0,00 % |
| Flash point (T.C.C) | n.a. |
| Total Acid Number | 25 mg KOH/g ± 2 |
| IPC/ EN | OR/ L0 |
Key advantages:
Pacific 2009MLF
VOC free, No-clean and halide free soldering flux for spray applications
Technical Data Sheet Pacific 2009MLF
Preheating for water based fluxes
Description:
PacIFic 2009MLF has been developed to minimize micro solder ball formation. It is an adapted version of the PacIFic 2009M.
Conventional VOC-free fluxes may give more solder balling than alcohol based fluxes on micro ball sensitive solder masks. PacIFic 2009MLF minimises micro solder balling on these solder masks.
PacIFic 2009MLF is absolutely halogen free. The flux allows a change over from alcohol based fluxes to water based fluxes with absolutely no disadvantages.
PacIFic 2009MLF is perfectly suitable for lead-free soldering and is typically applied by sprayfluxing.
Physical and chemical properties:
| Density at 20°C | 1.00 g/ml ± 0.01 |
| Colour | clear |
| Odour | sweet |
| Solid content (activity) | 3.6% ± 0.2 |
| Halide content | none |
| Flash point (T.O.C) | n.a. |
| Total Acid Number | 25 mg KOH/g ± 2 |
| IPC/ EN | OR/ L0 |
Key advantages:
Pacific 2009MLF-E
VOC free, no-clean and halide free soldering flux for spray applications
Technical Data Sheet Pacific 2009MLF-E
Preheating for water based fluxes
Description:
PacIFic 2009MLF-E is developed to combine low residue levels with minimal micro solder ball formation. It is an optimized version of the PacIFic 2009MLF.
Conventional VOC-free fluxes may give more solder balling than alcohol based fluxes on micro ball sensitive solder masks.
PacIFic 2009MLF-E reduces micro solder balling on these solder masks. The flux will leave less residue after soldering, while maintaining its micro solder ball reducing properties.
PacIFic 2009MLF-E is absolutely halogen free. The flux allows a change over from alcohol based fluxes to water based fluxes with absolutely no disadvantages. PacIFic 2009MLF-E is perfectly suitable for lead-free soldering and is typically applied by sprayfluxing.
Physical and chemical properties:
| Density at 20°C | 1.00 g/ml ± 0.01 |
| Colour | clear |
| Odour | sweet |
| Solid content (activity) | 3.6% ± 0.25 |
| Halide content | none |
| Flash point (T.O.C) | n.a. |
| Total Acid Number | 25 mg KOH/g ± 2 |
| IPC/ EN | OR/ L0 |
Key advantages:
Pacific 2010F
VOC free, no-clean and halide free soldering flux for foam and spray applications
Technical Data Sheet Pacific 2010F
Preheating for water based fluxes
Description:
The Interflux® PacIFic 2010F is an environmentally friendly water based flux, without any volatile organic compounds (VOC free).
The flux can be applied by means of foam, spray or dip fluxing.
PacIFic 2010F is absolutely halogen free, making it a very safe flux with high reliability properties.
The flux does not contain rosins nor resins. This will result in very low ICT contact problem faults.
PacIFic 2010F can be used for both SnPb and lead-free soldering applications.
Physical and chemical properties:
| Density at 20°C | 1.00 g/ml ± 0.01 |
| Colour | clear |
| Odour | sweet |
| Solid content (activity) | 2.5% ± 0.15 |
| Halide content | 0,00% |
| Flash point (T.O.C) | none |
| Total Acid Number | 16 mg KOH/g ± 2 |
| IPC/ EN | OR/ L0 |
Key advantages:
T 2005M ( Flux thinner)
InterFlux T2005M is the thinner/ conditioner for the IF2005-series fluxes. When used is foam fluxing or other open flux application.
