HIT520 Smart Screen Printer

HIT Gun  - Solder Pump Head

New developed solder pump head, with the advantage of supply solder paste automatically and saving cost to largest extent, is available and good for 0201 chip.


  • Auto. solder paste supply

  • Auto. pressure control

  • Perfect printing effect

  • No wasting of solder paste




HIT Catalog

X-axis printing head


  • Each axis movement of squeegee head is controlled by precise servo press independently to improve printing quality.

  • Customer can free exchange HIT GUN or conventional squeegee head according to actual requirement of production.



X-axis printing head


Adjusting squeegee head for mask wide range opening can have a better printing quality.





Description of the Stage


  • Mask decompression device

            After printing the solder perfectly separated from the mask, so that to realize high quality printing.

  • Flipper

           Clamping system special for bend or deistorted PCB

  • Two way stage up/down

            Two way stage moves up and down for high quality printing


Silicona mate inlaided in cleaning head

It can fit the mask more closely and make cleaning effect perfect.

Four Fiducial Mask Teaching System

As for the PCB that deformed or with high tolerance, four fiducial marks can ensure more accurate when printing, while only two fiducial marks would lead more deviation.




Automatic Mask Moving Device

The new stencil moves to the printing position automatically.

SPI Printing Feedback System

After received the feedback information of bad printing from SPI, the printer can inspect and clean the mask holes automatically, thus improve printing quality and production rate.




Precision Camera Scanning

2D inspection

  • FOV: 2.5 mm x 8mm
  • Size: 0.3 mm and over at most 500 teaching window
  • Driven by Panasonic servo motor and accurate ball screw

The segment Conveyors

Adopt Korea imported conveyor belt in the three segment conveyors







HIT520Smart   Specifications
Mask Min. size 650x550 mm
Max. size 650x650 mm
PCB Size 50x50~330x250 mm
Thickness/Weight 0.4 mm~6 mm / 4kg
Under clearance 17 mm
  Transport direction left->right/ right->left (Option)
Squeegee Squeegee type Metal squeegee/HIT GUN (soplder pump head)
Length 250 mm, 350 mm, 420 mm, 460 mm, 600 mm
Moving direction X axis moving
Printing Accuracy/Speed ±12.5 μm @ 6 sigma/ 1~300mm/s
    8s (Excluding printing time)
Fiducial Mark Type User defined
Size 0.5 mm~3 mm
Mark number Two, Three, Four
Snap off Type Vacuum/Decompression
Speed/Distance 0.5 mm/s~ 30 mm/s / 0~5 mm
Cleaning System Type dry/wet/vacuum/air
Cleaning head Silicone pad
2D Inspection Fov Camera 8.5 mm x 8 mm, CIS 640 x 480 Japan
Inspection solder small or miss
Inspection Size 0.3 mm, over 0.3 mm
Max Teaching Window 500 window available
SPI Communication Type printing offset and cleaning
Air Condition System   PC Control system (option)
Other Size/Weight 1330 x 1375 x 1490 mm/ 800 kg
Power supply/Air supply 220 V± 20V, 2KW 50/60 Hz/ 4~6/cm2
Operation system Windows XP, Flash Memory Type HDD