Bare de aliaj

SOLDER ALLOYS

LMPA Solder Alloys

SnBi based low melting point soldering alloys

Description

LMPA™ Solder alloys are high purity low melting point soldering alloys.They exhibit very low dross formation in wave soldering machines without nitrogen. The use of LMPA™-Oil is advisable for initial filling and maintenance. In selective soldering machines, the use of nitrogen is advisable. LMPA™ Solder alloys give much less Cu dissolution from the PCB board than Sn (Ag)Cu alloys. Beside their use in wave and selective soldering, the alloys are also available as a solder paste for reflow soldering. The LMPA™ alloys have increased mechanical properties compared to the SnBi(Ag) alloys. This makes them the perfect drop-in alloys for many electronic applications that are today being soldered with Sn (Ag)Cu alloys . The low melting point of LMPA™ alloys allow for lower solder bath temperatures and lower or shorter preheating profiles. This will result in reduced energy consumption, lower costs and increased line capacity and production speeds. Board and components will experience less stress, resulting in less ageing and longer life time of the electronic unit.

Key properties

Fast through hole wetting
Much less Cu dissolution from the PCB
Reduced cost of production
Increased line capacity
Lower thermal stress on the electronic unit
Longer life time of the electronic unit

Health and safety

Please always consult the safety datasheet of the product.

alloy	melting T°	packaging
LMPA™-Q	139°C-176°C	+/- 320g bars in 20 kg box (box size: ~24x15x8cm) +/- 2,5kg bars in 18,5 kg box (box size: ~27x20x8cm) Stones +/- ø 37mm x 15mm in 2,5kg jar 2mm plain wire on spool 3mm plain wire on 4kg spool